JPH0423324Y2 - - Google Patents

Info

Publication number
JPH0423324Y2
JPH0423324Y2 JP1986099861U JP9986186U JPH0423324Y2 JP H0423324 Y2 JPH0423324 Y2 JP H0423324Y2 JP 1986099861 U JP1986099861 U JP 1986099861U JP 9986186 U JP9986186 U JP 9986186U JP H0423324 Y2 JPH0423324 Y2 JP H0423324Y2
Authority
JP
Japan
Prior art keywords
wire
bonding
arm
lever
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986099861U
Other languages
English (en)
Japanese (ja)
Other versions
JPS636733U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986099861U priority Critical patent/JPH0423324Y2/ja
Publication of JPS636733U publication Critical patent/JPS636733U/ja
Application granted granted Critical
Publication of JPH0423324Y2 publication Critical patent/JPH0423324Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1986099861U 1986-07-01 1986-07-01 Expired JPH0423324Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986099861U JPH0423324Y2 (en]) 1986-07-01 1986-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986099861U JPH0423324Y2 (en]) 1986-07-01 1986-07-01

Publications (2)

Publication Number Publication Date
JPS636733U JPS636733U (en]) 1988-01-18
JPH0423324Y2 true JPH0423324Y2 (en]) 1992-05-29

Family

ID=30969133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986099861U Expired JPH0423324Y2 (en]) 1986-07-01 1986-07-01

Country Status (1)

Country Link
JP (1) JPH0423324Y2 (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854500B2 (ja) * 1979-04-17 1983-12-05 株式会社新川 ワイヤボンデイング装置

Also Published As

Publication number Publication date
JPS636733U (en]) 1988-01-18

Similar Documents

Publication Publication Date Title
US4340166A (en) High speed wire bonding method
JP2771963B2 (ja) ホッグリング締結装置
JPH0423324Y2 (en])
JPS58112288U (ja) ミシン用上方送り装置
JPS6335288A (ja) ミシン用切断装置
JPH10328767A (ja) ツイン型グリッパフィード
JPS6162491A (ja) ミシンの送り装置
CN2317238Y (zh) 缝纫机的剪线装置
JP2630818B2 (ja) 貼付片止付装置
JP2579258B2 (ja) 部品供給制御装置
JP2575066B2 (ja) 半導体組立装置
JPS6247383U (en])
JP2627968B2 (ja) 半導体組立装置
JPH09223711A (ja) ワイヤボンディング装置用ワイヤカットフィード装置
JPH0233970Y2 (en])
JP2511690Y2 (ja) トロイダル巻線用コア送り装置
JPH0213818B2 (en])
JPS61269322A (ja) ワイヤボンデイング装置
JP2598395Y2 (ja) 自動布線機用電線チャック機構
JPS5918677Y2 (ja) ワイヤボンデイング装置
JPH01315198A (ja) 電子部品規正装置
JPH0350873Y2 (en])
JPS59172794U (ja) レ−ス刺しゆう機
JPH0621695Y2 (ja) スプールランナー分離機
JPH07120693B2 (ja) 半導体内部接続装置